


Tailored engineering solutions for every industry
Tailored engineering solutions for every industry
Tailored engineering solutions for every industry
Driving automotive innovation
driving automotive innovation
Automotive
Automotive
Automotive
The automotive industry's transformation toward electrification, automation, and connectivity requires highly specialized ASIC and SoC solutions that meet stringent functional safety requirements. Our engineering expertise powers the development of custom silicon for advanced driver assistance systems (ADAS), autonomous driving platforms, and next-generation infotainment systems.
From engine control units to sophisticated vision processing chips with our world-class 28-bit dynamic range image processing capabilities, our designs meet the rigorous reliability and safety standards of automotive applications. We understand the unique challenges of automotive environments, including extreme temperature variations, electromagnetic compatibility, and the need for functional safety compliance, ensuring our custom chip designs support vehicle lifecycles spanning decades.
We are Germany’s largest independent engineering turn-key service provider with a cutting-edge focus on the development and design of ASICs, SoCs, FPGAs, embedded software and complex systems. We have thorough internal knowledge around all aspects of custom SoC design from the idea through the architecture phase towards tape-out and post-silicon bring-up.
Our home base is high-end automotive and latest HPC, but with our world-class vision know-how, we are your natural partner for anything around high-end automotive FuSa certified 28bit dynamic range image processing, miniature HDR capable camera products (Atom Camera) and custom vision SoCs. Being a part of the Tessolve group enables us to offer a full turn-key service with no complexity limits.
The automotive industry's transformation toward electrification, automation, and connectivity requires highly specialized ASIC and SoC solutions that meet stringent functional safety requirements. Our engineering expertise powers the development of custom silicon for advanced driver assistance systems (ADAS), autonomous driving platforms, and next-generation infotainment systems.
From engine control units to sophisticated vision processing chips with our world-class 28-bit dynamic range image processing capabilities, our designs meet the rigorous reliability and safety standards of automotive applications. We understand the unique challenges of automotive environments, including extreme temperature variations, electromagnetic compatibility, and the need for functional safety compliance, ensuring our custom chip designs support vehicle lifecycles spanning decades.
powering smart manufacturing
Industry
Industry
Industry
The industrial automation sector demands highly specialized ASIC and SoC designs that can withstand demanding environments while delivering precise control and real-time processing capabilities. Our engineering expertise enables the development of custom silicon solutions for PLCs, human-machine interfaces, industrial PCs, and robotic control systems.
From factory floor automation to sophisticated process control applications, we design chips that ensure seamless operation in mission-critical environments. We understand that industrial applications require extended temperature ranges, enhanced durability, and long-term component availability, which is why our custom designs are engineered to exceed industry standards and provide consistent performance throughout extended operational lifecycles in harsh manufacturing environments.
We are Germany’s largest independent engineering turn-key service provider with a cutting-edge focus on the development and design of ASICs, SoCs, FPGAs, embedded software and complex systems. We have thorough internal knowledge around all aspects of custom SoC design from the idea through the architecture phase towards tape-out and post-silicon bring-up.
Our home base is high-end automotive and latest HPC, but with our world-class vision know-how, we are your natural partner for anything around high-end automotive FuSa certified 28bit dynamic range image processing, miniature HDR capable camera products (Atom Camera) and custom vision SoCs. Being a part of the Tessolve group enables us to offer a full turn-key service with no complexity limits.
The industrial automation sector demands highly specialized ASIC and SoC designs that can withstand demanding environments while delivering precise control and real-time processing capabilities. Our engineering expertise enables the development of custom silicon solutions for PLCs, human-machine interfaces, industrial PCs, and robotic control systems.
From factory floor automation to sophisticated process control applications, we design chips that ensure seamless operation in mission-critical environments. We understand that industrial applications require extended temperature ranges, enhanced durability, and long-term component availability, which is why our custom designs are engineered to exceed industry standards and provide consistent performance throughout extended operational lifecycles in harsh manufacturing environments.
Enabling intelligent connectivity
Internet of Things
Internet of Things
Internet of Things
The IoT ecosystem requires highly optimized, application-specific integrated circuits that balance computational power with ultra-low power consumption and minimal form factors. Our engineering team specializes in designing custom SoCs that enable seamless connectivity across edge computing, fog networks, and cloud infrastructure.
Whether developing chips for smart sensors, industrial monitoring systems, or autonomous IoT networks, we create tailored silicon solutions that provide the perfect balance of processing power and energy efficiency. Our designs bridge the gap between local intelligence and cloud connectivity, ensuring optimal data processing, secure communication, and extended battery life in resource-constrained IoT deployments across diverse industry applications.
We are Germany’s largest independent engineering turn-key service provider with a cutting-edge focus on the development and design of ASICs, SoCs, FPGAs, embedded software and complex systems. We have thorough internal knowledge around all aspects of custom SoC design from the idea through the architecture phase towards tape-out and post-silicon bring-up.
Our home base is high-end automotive and latest HPC, but with our world-class vision know-how, we are your natural partner for anything around high-end automotive FuSa certified 28bit dynamic range image processing, miniature HDR capable camera products (Atom Camera) and custom vision SoCs. Being a part of the Tessolve group enables us to offer a full turn-key service with no complexity limits.
The IoT ecosystem requires highly optimized, application-specific integrated circuits that balance computational power with ultra-low power consumption and minimal form factors. Our engineering team specializes in designing custom SoCs that enable seamless connectivity across edge computing, fog networks, and cloud infrastructure.
Whether developing chips for smart sensors, industrial monitoring systems, or autonomous IoT networks, we create tailored silicon solutions that provide the perfect balance of processing power and energy efficiency. Our designs bridge the gap between local intelligence and cloud connectivity, ensuring optimal data processing, secure communication, and extended battery life in resource-constrained IoT deployments across diverse industry applications.
Powering sustainable energy infrastructure
Hyperscaler
Hyperscaler
Hyperscaler
The transition to renewable energy and smart grid technologies requires sophisticated custom silicon solutions that can manage complex power distribution, monitoring, and control systems. Our engineering services enable the development of specialized ASICs for smart meters, grid management equipment, solar inverters, and energy storage controllers.
We design custom chips that handle real-time power monitoring, load balancing, and grid stabilization while maintaining high efficiency and reliability. Our energy-focused silicon solutions are engineered to operate in challenging electrical environments with high electromagnetic interference and support the seamless integration of renewable energy sources into existing power infrastructure, enabling the next generation of intelligent energy management systems.
We are Germany’s largest independent engineering turn-key service provider with a cutting-edge focus on the development and design of ASICs, SoCs, FPGAs, embedded software and complex systems. We have thorough internal knowledge around all aspects of custom SoC design from the idea through the architecture phase towards tape-out and post-silicon bring-up.
Our home base is high-end automotive and latest HPC, but with our world-class vision know-how, we are your natural partner for anything around high-end automotive FuSa certified 28bit dynamic range image processing, miniature HDR capable camera products (Atom Camera) and custom vision SoCs. Being a part of the Tessolve group enables us to offer a full turn-key service with no complexity limits.
The transition to renewable energy and smart grid technologies requires sophisticated custom silicon solutions that can manage complex power distribution, monitoring, and control systems. Our engineering services enable the development of specialized ASICs for smart meters, grid management equipment, solar inverters, and energy storage controllers.
We design custom chips that handle real-time power monitoring, load balancing, and grid stabilization while maintaining high efficiency and reliability. Our energy-focused silicon solutions are engineered to operate in challenging electrical environments with high electromagnetic interference and support the seamless integration of renewable energy sources into existing power infrastructure, enabling the next generation of intelligent energy management systems.
Building tomorrow's communication infrastructure
Communication
Communication
Communication
The telecommunications industry relies on high-performance, application-specific chip designs to maintain the constant flow of data across global networks. Our engineering services power the development of custom ASICs and SoCs for base stations, network switches, routers, and communication servers that form the backbone of modern connectivity infrastructure.
From 5G network equipment to fiber-optic communication systems, our custom silicon designs ensure reliable, high-speed data transmission with minimal latency and optimal power efficiency. We develop tailored solutions that can handle massive data throughput while maintaining thermal management and meeting the stringent reliability requirements of telecommunications equipment that operates continuously in demanding network environments.
We are Germany’s largest independent engineering turn-key service provider with a cutting-edge focus on the development and design of ASICs, SoCs, FPGAs, embedded software and complex systems. We have thorough internal knowledge around all aspects of custom SoC design from the idea through the architecture phase towards tape-out and post-silicon bring-up.
Our home base is high-end automotive and latest HPC, but with our world-class vision know-how, we are your natural partner for anything around high-end automotive FuSa certified 28bit dynamic range image processing, miniature HDR capable camera products (Atom Camera) and custom vision SoCs. Being a part of the Tessolve group enables us to offer a full turn-key service with no complexity limits.
The telecommunications industry relies on high-performance, application-specific chip designs to maintain the constant flow of data across global networks. Our engineering services power the development of custom ASICs and SoCs for base stations, network switches, routers, and communication servers that form the backbone of modern connectivity infrastructure.
From 5G network equipment to fiber-optic communication systems, our custom silicon designs ensure reliable, high-speed data transmission with minimal latency and optimal power efficiency. We develop tailored solutions that can handle massive data throughput while maintaining thermal management and meeting the stringent reliability requirements of telecommunications equipment that operates continuously in demanding network environments.
Protecting digital infrastructure
Security
Security
Security
In today's interconnected world, hardware-level security has become critical across all industries. Our engineering expertise enables the development of specialized ASICs with advanced security features including hardware encryption engines, secure authentication processors, and tamper-resistant boot systems. From access control devices to biometric identification systems, our custom chip designs form the foundation of trusted security infrastructure.
We engineer solutions that implement sophisticated cryptographic algorithms while maintaining high performance and low power consumption. Our security-focused ASIC designs help prevent unauthorized access, protect sensitive information, and ensure system integrity in applications ranging from smart card controllers to enterprise security hardware and automotive security modules.
We are Germany’s largest independent engineering turn-key service provider with a cutting-edge focus on the development and design of ASICs, SoCs, FPGAs, embedded software and complex systems. We have thorough internal knowledge around all aspects of custom SoC design from the idea through the architecture phase towards tape-out and post-silicon bring-up.
Our home base is high-end automotive and latest HPC, but with our world-class vision know-how, we are your natural partner for anything around high-end automotive FuSa certified 28bit dynamic range image processing, miniature HDR capable camera products (Atom Camera) and custom vision SoCs. Being a part of the Tessolve group enables us to offer a full turn-key service with no complexity limits.
In today's interconnected world, hardware-level security has become critical across all industries. Our engineering expertise enables the development of specialized ASICs with advanced security features including hardware encryption engines, secure authentication processors, and tamper-resistant boot systems. From access control devices to biometric identification systems, our custom chip designs form the foundation of trusted security infrastructure.
We engineer solutions that implement sophisticated cryptographic algorithms while maintaining high performance and low power consumption. Our security-focused ASIC designs help prevent unauthorized access, protect sensitive information, and ensure system integrity in applications ranging from smart card controllers to enterprise security hardware and automotive security modules.
Enabling reliable operation
enabling reliable operation
Transport
Transport
Transport
Transportation systems across rail, maritime, aviation, and heavy industry sectors require specialized ASIC solutions that can withstand extreme operational conditions while maintaining mission-critical reliability. Our engineering expertise enables the development of ruggedized custom chips for navigation systems, fleet management platforms, and safety-critical control systems.
From locomotive control electronics to marine navigation equipment and avionics systems, our tailored silicon solutions ensure reliable operation in environments characterized by temperature extremes, mechanical vibration, electromagnetic interference, and extended operational periods. We design custom ASICs that meet the strict certification requirements of transportation industries while providing the processing power and reliability needed for modern mobility and logistics applications in the world's most demanding environments.
We are Germany’s largest independent engineering turn-key service provider with a cutting-edge focus on the development and design of ASICs, SoCs, FPGAs, embedded software and complex systems. We have thorough internal knowledge around all aspects of custom SoC design from the idea through the architecture phase towards tape-out and post-silicon bring-up.
Our home base is high-end automotive and latest HPC, but with our world-class vision know-how, we are your natural partner for anything around high-end automotive FuSa certified 28bit dynamic range image processing, miniature HDR capable camera products (Atom Camera) and custom vision SoCs. Being a part of the Tessolve group enables us to offer a full turn-key service with no complexity limits.
Transportation systems across rail, maritime, aviation, and heavy industry sectors require specialized ASIC solutions that can withstand extreme operational conditions while maintaining mission-critical reliability. Our engineering expertise enables the development of ruggedized custom chips for navigation systems, fleet management platforms, and safety-critical control systems.
From locomotive control electronics to marine navigation equipment and avionics systems, our tailored silicon solutions ensure reliable operation in environments characterized by temperature extremes, mechanical vibration, electromagnetic interference, and extended operational periods. We design custom ASICs that meet the strict certification requirements of transportation industries while providing the processing power and reliability needed for modern mobility and logistics applications in the world's most demanding environments.
advancing healthcare
Medical
Medical
Medical
Medical device applications demand the highest levels of reliability, security, and precision from custom silicon solutions. Our specialized engineering services power the development of ASICs for critical healthcare equipment, from diagnostic devices to patient monitoring systems and advanced medical imaging technology.
We understand that medical electronics operate in environments where failure is not an option, which is why our custom chip designs undergo rigorous verification processes and meet the strictest medical industry standards. Our engineering expertise supports real-time signal processing, secure patient data handling, and compliance with medical device regulations, enabling healthcare technology companies to deliver breakthrough innovations that improve patient outcomes through advanced electronic systems.
We are Germany’s largest independent engineering turn-key service provider with a cutting-edge focus on the development and design of ASICs, SoCs, FPGAs, embedded software and complex systems. We have thorough internal knowledge around all aspects of custom SoC design from the idea through the architecture phase towards tape-out and post-silicon bring-up.
Our home base is high-end automotive and latest HPC, but with our world-class vision know-how, we are your natural partner for anything around high-end automotive FuSa certified 28bit dynamic range image processing, miniature HDR capable camera products (Atom Camera) and custom vision SoCs. Being a part of the Tessolve group enables us to offer a full turn-key service with no complexity limits.
Medical device applications demand the highest levels of reliability, security, and precision from custom silicon solutions. Our specialized engineering services power the development of ASICs for critical healthcare equipment, from diagnostic devices to patient monitoring systems and advanced medical imaging technology.
We understand that medical electronics operate in environments where failure is not an option, which is why our custom chip designs undergo rigorous verification processes and meet the strictest medical industry standards. Our engineering expertise supports real-time signal processing, secure patient data handling, and compliance with medical device regulations, enabling healthcare technology companies to deliver breakthrough innovations that improve patient outcomes through advanced electronic systems.
VISION COMPANY
News
News
Explore insights, trends, and tips in our engaging blog posts.
Explore insights, trends, and tips in our engaging blog posts.

Trade show
Join Us at NAB 2025 – Experience the Future of Imaging!

Trade show
Join Us at NAB 2025 – Experience the Future of Imaging!

News
Innovation Project Launched: AI-Based Surface Inspection and Automated Damage Detection for Vehicle Assessment

News
Innovation Project Launched: AI-Based Surface Inspection and Automated Damage Detection for Vehicle Assessment

Trade show
Meet Dream Chip at Embedded World 2025!

Trade show
Meet Dream Chip at Embedded World 2025!

News
Dream Chip Featured in Arteris’ Latest Innovation Announcement

News
Dream Chip Featured in Arteris’ Latest Innovation Announcement

Trade show
Join Us at NAB 2025 – Experience the Future of Imaging!

News
Innovation Project Launched: AI-Based Surface Inspection and Automated Damage Detection for Vehicle Assessment

Trade show
Meet Dream Chip at Embedded World 2025!

Trade show
Join Us at NAB 2025 – Experience the Future of Imaging!

News
Innovation Project Launched: AI-Based Surface Inspection and Automated Damage Detection for Vehicle Assessment

Trade show
Meet Dream Chip at Embedded World 2025!
Our Offices
Hannover
Steinriede 10
30827 Garbsen, Germany
Hamburg
Mönckebergstraße 13
20095 Hamburg, Germany
Eindhoven
Burgemeester Mollaan 70
5582 CK Waalre, Netherlands
Braunschweig
In den Lohbalken 7
38165 Lehre-Wendhausen
Duisburg
NEW
Our Offices
Hannover
Steinriede 10
30827 Garbsen, Germany
Hamburg
Mönckebergstraße 13
20095 Hamburg, Germany
Eindhoven
Burgemeester Mollaan 70
5582 CK Waalre, Netherlands
Braunschweig
In den Lohbalken 7
38165 Lehre-Wendhausen
Duisburg
NEW
Our Offices
Hannover
Steinriede 10, 30827 Garbsen, Germany
Hamburg
Mönckebergstraße 13, 20095 Hamburg, Germany
Eindhoven
Burgemeester Mollaan 70, 5582 CK Waalre, Niederlande
Braunschweig
In den Lohbalken 7
38165 Lehre-Wendhausen
Duisburg
NEW
Our Offices
Hannover
Steinriede 10
30827 Garbsen, Germany
Hamburg
Mönckebergstraße 13
20095 Hamburg, Germany
Eindhoven
Burgemeester Mollaan 70
5582 CK Waalre, Netherlands
Braunschweig
In den Lohbalken 7
38165 Lehre-Wendhausen
Duisburg
NEW