Stronger. Smarter. Side by Side.
We are excited to announce that Tessolve and Dream Chip Technologies will be at embedded world 2026 in Nuremberg – and for the first time ever, with a large booth presence – stronger side by side! We will bring our combined expertise to life – showcasing how our end-to-end capabilities accelerate innovation from concept to deployment.
Visit our booth to explore:
• Image Signal Processing IP
• IC design & SoC architecture services
• Chip development platforms
• Embedded systems & software
All tailored for cutting-edge applications like:
• Edge AI & Physical AI
• Machine Vision
• Test Automation
• Autonomous Systems
Our solutions enable key markets including Smart Mobility, IoT & Industrial, Digital Infrastructure and more.
Come meet our experts, see live demos, and discover how our formula works:
Tessolve + Dream Chip = Innovation that scales.
Find out more – we can’t wait to see you in Nuremberg!
📍 Hall 4 | Booth 4-126
📅 March 10–12, 2026
