We are proud to contribute to the European CHASSIS program's implementation of the Automotive Base Die chiplet. The 5nm chiplet is set to revolutionize the automotive semiconductor landscape, laying the foundation for the open and standardized chiplet ecosystem that will enable the next generation of software-defined vehicles.
The Automotive Base Die acts as the central communication and integration hub for automotive System-on-Chip (SoC) infrastructure, which is designed to enable seamless integration of third-party chiplets via the Universal Chiplet Interconnect Express (UCIe) standard. The Automotive Base Die, funded within the Chips-JU program CHASSIS by leading European entities BMW, imec, and Bosch, aims to enable unprecedented flexibility and innovation in the automotive industry.
Our expertise has been instrumental in the development of this foundational technology. Beyond the entire SoC chiplet architecture, design and integration in the TSMC N5A technology node, we have provided our automotive-certified ISP (Image Signal Processor) and Safety Island IP, as well as our leading-edge development platform.
"We are incredibly proud to be a key contributing partner in the CHASSIS program and to contribute to such a transformative project for the European automotive industry," said Dr. Jens Benndorf, CEO of Dream Chip Technologies. "Our proven track record in SoC development, deep expertise in automotive vision IP, and our advanced chip development platform align perfectly with the goals of the Automotive Base Die, enabling the necessary ecosystem for future vehicle architectures. This collaboration underscores our commitment to advancing innovation and establishing open standards for software-defined vehicles."
The CHASSIS program, coordinated by Bosch, is a three-year European research project focused on creating an open chiplet ecosystem for secure and scalable technology in software-defined mobility. The Automotive Base Die represents a significant step towards CHASSIS’s goal of establishing a standardized, open chiplet-based platform that will drive competition and foster innovation across the industry.
By enabling early interoperability testing with other chiplets and accelerating European-centric design, the Automotive Base Die is poised to strengthen Europe's position in advanced semiconductor design and manufacturing, while fostering a more agile and innovative automotive supply chain.
CHASSIS receives funding within the Chips Joint Undertaking (Chips JU) and National Authorities under grant agreement 101252788.
